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System-on-a-Chip: Design and Test
If you are a seller for this product, would you like to suggest updates through seller support? Learn more about Amazon Prime. Starting with a basic overview of system-on-a-chip SoC including definitions of related terms, this text explains SoC design challenges, together with developments in SoC design and and test methodologies. Read more Read less. Customers who viewed this item also viewed. Page 1 of 1 Start over Page 1 of 1.
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Share your thoughts with other customers. Write a customer review. Amazon Giveaway allows you to run promotional giveaways in order to create buzz, reward your audience, and attract new followers and customers. Throughout this conversion process, the design is analyzed with static timing modeling, simulation and other tools to ensure that it meets the specified operational parameters such as frequency, power consumption and dissipation, functional integrity as described in the register transfer level code and electrical integrity. When all known bugs have been rectified and these have been re-verified and all physical design checks are done, the physical design files describing each layer of the chip are sent to the foundry's mask shop where a full set of glass lithographic masks will be etched.
These are sent to a wafer fabrication plant to create the SoC dice before packaging and testing. SoC designs usually consume less power and have a lower cost and higher reliability than the multi-chip systems that they replace. And with fewer packages in the system, assembly costs are reduced as well. However, like most VLSI designs, the total cost [ clarification needed ] is higher for one large chip than for the same functionality distributed over several smaller chips, because of lower yields [ clarification needed ] and higher non-recurring engineering costs.
When it is not feasible to construct an SoC for a particular application, an alternative is a system in package SiP comprising a number of chips in a single package. When produced in large volumes, SoC is more cost-effective than SiP because its packaging is simpler. SoC research and development often compares many options. From Wikipedia, the free encyclopedia. This article may be too technical for most readers to understand. Please help improve it to make it understandable to non-experts , without removing the technical details. May Learn how and when to remove this template message. This section does not cite any sources.
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